Source of original news: Super Internet thinking
FSE: IFX / OTCQX: IFNNY will enter the packaging silicon microphone market to meet the market demand for high-performance, low noise MEMS microphones. The analog and digital microphone are based on Infineon's double backboard MEMS technology, and the 70 dB signal-to-noise ratio (SNR) makes it stand out. At the same time the microphone at 135 dB SPL (SPL) degree of distortion is very low: 10%. The microphone is packaged with 4 mm x 3 mm x 1.2 mm MEMS and is very suitable for high quality recording and far field voice capture applications.
"This is the expansion of the mature and large capacity naked MEMS and ASIC business, which is hand in hand with our global packaging partners," Dr. Roland Helm, senior director of Infineon power management and diversified marketing division and director of sensor products series, said. We will continue to strengthen and develop the naked film business, and we also meet the needs of low - noise and high-end market through two new packaging microphones. "
The current MEMS microphone technology uses acoustic wave induced film and static backplane. Infineon's double backboard MEMS technology uses a film embedded in the two backplane to produce real differential signals. This can improve the high frequency anti-interference, ensure better audio signal processing effect, and increase the total harmonic distortion (THD) 10% of the sound overload point to 135 dB SPL.
The signal to noise ratio is 70 dB, and the improvement of 6 dB is achieved compared with the traditional MEMS microphone. This improvement is equivalent to doubling the distance between the user and the voice command captured by the microphone. In addition, the analog and digital microphone has excellent microphone to microphone matching (+ 1 dB sensitivity matching and + 2 degree phase matching) characteristics, which is very suitable for array deployment. For this reason, the MEMS microphone is very suitable for ultra precise beamforming and noise reduction.
This low noise analog and digital package MEMS microphone will provide engineering samples in the fourth quarter of 2017, and will be put into production in the first quarter of 2018.