Source: label: int-thinking.net semiconductor components and manufacturing source: yxchip

1. MLCC demand has picked up, and more companies plan to raise prices

Multi-layer ceramic capacitors (MLCC) are one of the most used components in the electronics industry, often known as "electronic industry rice", it reported, citing CCTV Finance. Affected by the sluggish downstream demand, the shipment price of MLCC continued to decline in the first two years, and the price decline cycle was more than 14 months. However, since the beginning of this year, the shipment of such components began to increase greatly, and some enterprises have recently released product price increase letters.

Analysts said that in the first quarter of this year, different models, different specifications of products are more or less raised prices, high-capacity products ranging from 20% to 40%. The reporter learned in the interview, at present, several larger domestic MLCC production enterprises have appeared production and sales price increase. For the next shipment expectations, all the companies hold a more optimistic view, more MLCC manufacturers are planning to raise prices.

2. TSMC may increase the wafer foundry price by more than 3% in the second half of the year

According to the science and Technology Innovation Board Daily quoted Taiwan, China electronic Times, IC design company said that the upstream and downstream rushed to quickly reduce inventory, but only TSMC does not move, although facing ten customers cut single thunder, capacity utilization rate collapse crisis, OEM price is still strong, do not give bargaining opportunities.

Its internal firmly believes that the semiconductor inventory adjustment, the economy will eventually recover, the second half of 2023 to 2024 is expected to usher in a new wave of growth momentum. With the bottom of the first half of the year and the recovery of the economic demand in the second half of the year, TSMC may increase the contribution of individual processes and customer orders in the second half of 2023 or 2024 / 2, with a jump of 3%. TSMC said it would not respond to the market rumors.

3.PC customers start to place urgent orders, and the visibility of supply chain orders is shortened

According to the Taiwan, China electronic Times quoted by science and Technology Innovation Board Daily, PC / electricity supply chain revealed that with the customer inventory reduction enters the late stage, the inventory problem eased, but worry that the market consumption power is weak, resulting in the high inventory again, so there is a conservative order trend.

However, based on there is still a certain demand in the market, so the customer order form to urgent orders. At present, the time from order to shipment is required to be less than 3 weeks, so the visibility of the subsequent market is gradually reduced to 1-1.5 months.

4. Jibang: memory and NAND flash memory prices continued to fall in the second quarter

According to the latest report released by TrendForce, DRAM and NAND prices are expected to continue to fall in the second quarter of 2023 due to weaker server shipments and continued inventory pressure, IT Home reported.

DRAM price declines widened to 13-18%, PC DRAM to 15-20%, server DRAM also widened to 15-20% and mobile DRAM to 13% -1 8%.

NAND estimates that the decline expanded to 8% -13%, UFS, the smartphone brand memory inventory correction came to an end, although the momentum of pulling goods compared with last year, but the supplier inventory pressure is still high, so the willingness to profit promotion also increased.

5. Infineon signed a memorandum with Hon Hai to focus on silicon carbide development

Infineon has signed a memorandum of understanding with Hon Hai Technology Group, the world's largest electronics manufacturing service provider, aiming to establish a long-term partnership in electric vehicles to jointly develop advanced electric vehicles with efficient and intelligent functions, Infineon said on Tuesday.

According to the memorandum, the two companies will work together to introduce silicon carbide technology in high-power automotive applications such as traction inverters, on-board chargers and DC-DC converters. The two sides also plan to jointly set up a system application center in the Taiwan, China area, which is scheduled to be completed within this year.

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